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Particle Morphology Preparation & Evaluation Homepage

Open the manuscript of Synthesiology - English edition, Products and evaluation device of cosmetics for UV protection [PDF:1MB]

Open the manuscript of The 20th Japan-Korea Seminar on Ceramics Nov. 21 (Fri.) 2003, Shimane

Welcome to Dr. Yasumasa TAKAO's website. I present my own viewpoints and some information about particle technology and filler-particle.

National Institute of Advanced Industrial Science and Technology 2266 Anagahora, Shimo-Shidami, moriyama-ku, Nagoya, Aichi 463-8560, Japan(Map)

-> Contact

1. Information

I will show you some useful information about particle technology and filler-particle. (Still under construction.)

1. Needs for particulate morphology control and evaluation (under constructing)
2. Load map for thermal conductive filler
3. Needs for filler (Semiconductor package, tablet-shaped drug)
4. Needs of particulate morphology control and evaluation on a particle-shaped material (Aluminum nitride powder)
5. Needs of particulate morphology control and evaluation on a sintered body type material (high temperature material, optics)
6. Needs for particulate morphology evaluation (Semiconductor package, tablet-shaped drug)
7. Patent load map
1. Particle morphology control
2. Particle morphology evaluation
3. Semiconductor package
4. thermal conductive filler
5. high temperature material, optics
6. DPI, dry powder inhalation
8. Introduction of research groups for particulate morphology control and evaluation
9. AIST groups about particle technology and filler-particle
10. <Application> Compaction type particulate system material
1. Intel CPU road map (Moore's law), and its encountered problem (dielectric constant)
2. Heat radiation problem generated from CPU (thermal conductivity)
3. A promising solution "filler"; an improvement of thermal conduciveness (percolation), and an encapsulation of air in the device
4. An approach as thermal conductive filler
5. An approach as porous filler
6. Current condition of particulate morphology control and evaluation
7. Potential of particulate morphology control and evaluation
11. <Application> Dispertion type particulate system material
1. DPI, dry powder inhalation
2. VTT Processes (the Finland Technical Research Center) 2001-2002

2. Research   "Development of a new technology for particulate morphology control and evaluation"

New spherical particle preparation method and new particle morphology evaluation method are studied. Targets are the semiconductor package, thermal conductivity (percolation), dry powder inhalation etc.-> if you have a question, please contact me.

(1) Aimed goal (tactics) image;

1. <Morphology control> Spherical porous ceramic particle with high thermal conductive shell, which particle properties highly controlled (i.e., sphericity, macroscopic-elongation, microscopic-surface roughness, in-between particle amount of particle size distribution, on-surface particle amount of particle size distribution).
2. <Morphology evaluation> New particle morphology index, its detection method, software, how-to pack the particle.

(2) Future task (strategy) image;

1. Proposal of "the third" route for spherical particle, and its industrialization.
2. Proposal of the precise particle morphology index & evaluation procedure, and its standardization.

(3) Stocked results (presentation manuscript etc.)  

1. Road map　  1. Process　2. Material (Thermal conductive filler)
2. Particle morphology control
1. Application result to the semiconductor package with our method  (Ex.) AIST Today, 2001, US Patent(US2002047110)
2. Application result to the high temperature material, optics
3. Particle morphology evaluation
1. In-between & on-surface particle amount of particle size distribution  (Ex.) Advanced Powder Technology 2001, Patent(⇒JP2002060630)
2. Detection method of particle packing structure in particle & resin composite  (Ex.) Paper of Electrical Technology Society in Japan,  Paper of European Ceramic Society, Detection Patent(JP2002062254）, Rheology Patent(JP2002062237）
4. High controllable preparation of on-surface particle amount
1. Patent (⇒JP7132223)
2. Application;  Semiconductive gas sensor (⇒JP11326258)
5. "Tradeoff" synthesis of controllability and productivity (Ex.) Fluidized bed(⇒JP9290143)
6. Particle deposition method for thick film structure control (Ex.) Patent(⇒JP7007192) / Application; Semiconductive gas sensor (⇒JP11326258)
7. Combination with solution control process (Ex.) Spraying method(⇒JP7132223) / VTT Processes (the Finland Technical Research Center) 2001-2002

3. Paper & Patents etc.

　　1. Paper　　2. Patent　　3. Articles　　4. Oral presentation manuscript

4. CV (resume)

5. Topics

Copyright (C) 2002  [Yasumasa TAKAO] All rights reserved.