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The 20th Japan-Korea Seminar on Ceramics Nov. 21 (Fri.) 2003, Shimane

A Control-method of Shape/Size for Filler-powder of Semiconductor Package Molding Compound

  1. gA New-synthesish Non-oxide Spherical-particle Synthesis via gFireh
  2. gA New-evaluationh Particle-morphology Detection by gVirtual-sieveh

Table of Contents

  1. Motivation (1 slides) Early Studies & Technical Issues
  2. Experimental of Synthesis (1 slide) Viewpoint in This Study =gFree Energyh Issue=Synthesis-device Design (Gas-mixing)
  3. Highlight Data (7 slides) gGas Diffusionh, or gGas-phase Reactionh ?
  4. Summary & Achievement (1 slide)
  5. Future-Plan (Evaluation etc.) (1 slide)

Abstract

A control-method of shape & size-distribution of filler-powder for semiconductor package molding compound is built via some particulate-process technology. (1) Spherical non-oxide particle synthesis method by flame is presented, and its mechanism is correlated thermodynamically. We consider the changes in free energy of the systems Al, O2, N2, NH3 & hydrocarbons, and show some feasible thermodynamic equilibrium. Spherical filler-sized (i.e., over 1 micron) aluminum nitride particle is prepared. (2) A classification method of particle size distribution is submitted, and its quantification method of microscopic particle-content distributed among larger particles is considered. Small & large filler-powder ratios are calculated from the ratios of 10 & 90% diameters of cumulative under-size distributions measured by electrical sensing zone and light diffraction/scattering methods. The new index clarifies the conventional & high-purity silica-fillers have an opposite characteristic on the relationship between the size and rheological properties.

Copyright (C) 2002  [Yasumasa TAKAO] All rights reserved.