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A control-method of shape & size-distribution of filler-powder for semiconductor package molding compound is built via some particulate-process technology. (1) Spherical non-oxide particle synthesis method by flame is presented, and its mechanism is correlated thermodynamically. We consider the changes in free energy of the systems Al, O2, N2, NH3 & hydrocarbons, and show some feasible thermodynamic equilibrium. Spherical filler-sized (i.e., over 1 micron) aluminum nitride particle is prepared. (2) A classification method of particle size distribution is submitted, and its quantification method of microscopic particle-content distributed among larger particles is considered. Small & large filler-powder ratios are calculated from the ratios of 10 & 90% diameters of cumulative under-size distributions measured by electrical sensing zone and light diffraction/scattering methods. The new index clarifies the conventional & high-purity silica-fillers have an opposite characteristic on the relationship between the size and rheological properties.