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Particle morphology evaluation methods for size, in-between/on-surface amounts and shape are submitted; and their potentials are correlated on a semiconductor packaging material.
The early data have been taken from Light diffraction/scattering method. Needless to say, however, these analyses are based on the Equivalent-area diameter, so then, the accuracy of measurements may not be satisfactory. One other problem of this kind of method is there is no-way of knowing what is the more precise morphological powder property, for example, anisotropic parameter such as Circularity, and Inter-particle content dispersed in the whole powder.
Secondly, most of the early data have been taken from Size-distribution/Surface-area vs. Rheology analysis. In the 90s, under 1micron fine-particle adding method has been developed in Semiconductor Packaging Material. Recently, however, there are over 93wt% filler-loading demand, so then, theses previous evaluation method brings up to the Performance limit. For example, if ones set to the filler-powder properties to the Broad/Large sizes, or the many fine particle addition, however, but they don't always work.
In this present work, we have show one of Idea of Convenient Evaluation Method; it is the combination of light & electric method. The Point of view in this study is an Agreement of threshold-gap & semiconductor filler-size. In this present work, we have combined light & electric method, and found that their detection threshold differences can detect the Inter-particle content dispersed in the whole powder. This method clarified A New-discovered rheological phenomena in Conventional/High-purity Fillers.
From the results we have presented today, one might come up with the following idea, although it is a bit wishful at this point. As I talked at motivation slide, the previous evaluation method brings up to the Performance limit. This result suggests us due to insufficient resources of evaluation parameter. We can take advantage to predict & design material property with using these parameters. This paper offers also some new parameters and their detection route of the morphological indices by a virtual classification method. This method bases its sieve-scale on differences of measurable-size, time, magnification, angle & volume/area-ratio of several particle analyzers. These indices clarify that the conventional and/or high-purity silicas of the packaging material have an opposite characteristic on the relationship between size-distribution and rheological-property. This shows that the above morphological-indices and their detection methods can be a case in point of practical evaluation route to examine the package in the industrialization viewpoints.