Ippei Akita received the B.E., M.E., and Ph.D. degrees in Electronic and Information Engineering from Toyohashi University of Technology, Japan, in 2003, 2005, and 2008, respectively.In 2008, he joined Toshiba Corporation, where he engaged to develop AD/DA converters and OEICs for wireless/wireline communication systems. In 2011, he returned to Toyohashi University of Technology as an Assistant Professor and has developed low-power neural interface circuits and flexible thin-film packaging technologies for BCI systems. From 2016 to 2017, he was a visiting researcher at University of California, Los Angeles (UCLA), where he developed PMU and signal processing algorithm for implantable neural devices. Since 2018, he has been with National Institute of Advanced Industrial Science and Technology (AIST) as a Senior Researcher. His current research interests include sensor/analog mixed-signal LSI design for IoT applications. Dr.Akita was a Technical Program Committee member of the International Conference on Solid State Devices and Materials (SSDM) from 2014 to 2018, and was the Area 5 vice-Chair and Chair in 2016 and 2017, respectively. He is a member of the International Technical Program Committee for the IEEE International Solid-State Circuits Conference (ISSCC). |
| Degree's thesis |
| Low-voltage wide-dynamic range CMOS log domain filter using companding technique, Ph.D. in Eng. at Toyohashi University of Technology, March 2008. |
| Projects |
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| Keywords |
| Magnetometers, Biosensors, Pressure sensors, Accelerometers, Neural interfaces, Electrochemical impedance spectroscopy (EIS), Cyclic voltammetry (CV), Switched-capacitor DC-DC converters, Low-dropout (LDO) regulators, Li-ion battery chargers, Compressed sensing, Thin-film flexible devices, Instrumentation amplifiers (IAs), Digital-to-analog converters (DACs), Analog-to-digital converters (ADCs), optical transceivers, transimpedance amplifiers (TIAs), Analog filters, Operational amplifiers, etc. |